And Fangli YuanCollege of Chemistry and Materials Engineering, Beijing Technologies and Enterprise University, Beijing 100048, China; [email protected] State Crucial Laboratory of Multiphase Complicated Systems, Institute of Course of action Engineering, Chinese Academy of Sciences (CAS), Beijing 100190, China; [email protected] (X.L.); [email protected] (F.Y.) College of Power Engineering, Huanghuai University, Zhumadian 463000, China Correspondence: [email protected] (Y.O.); [email protected] (L.B.)Citation: Ouyang, Y.; Li, X.; Tian, H.; Bai, L.; Yuan, F. A Novel Branched Al2 O3 /Silicon Rubber Composite with Improved Thermal Conductivity and Great Electrical Insulation Overall performance. Nanomaterials 2021, 11, 2654. 10.3390/ nano11102654 Academic Editor: Fabien Grasset Received: 17 September 2021 Accepted: six October 2021 Published: 9 OctoberAbstract: Within this paper, we report a thermal conductive polymer composite that consists of silicone rubber (SR) and branched Al2 O3 (B-Al2 O3). Owing to the one of a kind two-dimensional branched structure, B-Al2 O3 particles kind a continuous three-dimensional network structure by overlapping each other in the matrix, serving as a continuous heat conductive pathway. Because of this, the polymer composite using a 70 wt filler achieves a maximum thermal conductivity of 1.242 Wm-1 K-1 , that is equivalent to a substantial MNITMT custom synthesis enhancement of 521 when compared with that of a pure matrix. Additionally, the composite maintains a higher volume resistivity of 7.94 1014 m together with the loading of 70 wt , indicating that it meets the specifications inside the field of electrical insulation. In addition, B-Al2 O3 fillers are effectively dispersed (no large agglomerates) and kind a sturdy interfacial adhesion with all the matrix. Therefore, the thermal decomposition temperature, residual mass, tensile strength, modulus and modulus of toughness of composites are significantly improved simultaneously. This tactic offers new insights for the style of high-performance polymer composites with possible application in sophisticated thermal management in modern day electronics. Keyword phrases: polymer composites; thermal conductivity; Al2 O3 ; continuous network; electrical insulation1. Introduction Using the advent in the 5G era, electronic devices and gear are establishing inside the direction of miniaturization and integration [1]. For that reason, the significant quantity of heat generated throughout the high-speed operation of electronic gear locations larger requirements on the thermal diffusion performance of polymer materials. Having said that, as a result of higher disorder of molecular segments, polymers Tetrachlorocatechol Protocol possess poor thermal conductivity (normally not larger than 0.two Wm-1 K-1), which limits the wider application of polymer materials in the field of electronic packaging [4]. In recent years, the introduction of fillers with high thermal conductivity into polymer matrix to prepare polymer composites has attracted a considerable quantity of consideration, and it has been confirmed that this can be an effective solution to enhance the thermal conductive home of polymer matrices in academia and sector [7,8]. Traditional thermal conductive fillers utilized to prepare higher thermal conductivity polymer composites involve metal fillers (Al and Cu), carbon-based materials (graphene and carbon nanotubes) and ceramic fillers (AlN, BN, Al2 O3 and SiC) [91]. However, the addition of metal fillers or carbon-based fillers tends to harm the insulation property on the material to a particular extent, while ceramic fillers.
